LPKF Laser & Electronics AG LPK
Dividend Summary
The previous LPKF Laser & Electronics AG dividend was 10¢ and it went ex over 3 years ago and it was paid over 3 years ago.
There is typically 1 dividend per year (excluding specials), and the dividend cover is approximately 2.0.
| Summary | Previous dividend | Next dividend |
|---|---|---|
| Status | Paid | – |
| Type | Final | – |
| Per share | 10¢ | – |
| Declaration date | 29 Mar 2021 (Mon) | – |
| Ex-div date | 21 May 2021 (Fri) | – |
| Pay date | 26 May 2021 (Wed) | – |
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| Status | Type | Decl. date | Ex-div date | Pay date | Decl. Currency | Forecast amount | Decl. amount | Accuracy |
|---|---|---|---|---|---|---|---|---|
| Paid | Final | 29 Mar 2021 | 21 May 2021 | 26 May 2021 | EUR | — | 10¢ | |
| Paid | Final | 24 Apr 2020 | 05 Jun 2020 | 09 Jun 2020 | EUR | — | 10¢ | |
| Paid | Final | – | 29 May 2015 | 29 May 2015 | EUR | — | 12¢ | |
| Paid | Final | – | 06 Jun 2014 | 06 Jun 2014 | EUR | — | 25¢ | |
| Paid | Final | – | 24 May 2013 | 24 May 2013 | EUR | — | 50¢ |
| Year | Amount | Change |
|---|---|---|
| 2006 | 0.0¢ | — |
| 2007 | 0.0¢ | 0% |
| 2008 | 0.0¢ | 0% |
| 2009 | 0.0¢ | 0% |
| 2010 | 0.0¢ | 0% |
| 2011 | 0.0¢ | 0% |
| 2012 | 50.0¢ | 100% |
| 2013 | 25.0¢ | -50.0% |
| 2014 | 12.0¢ | -52.0% |
| 2015 | 0.0¢ | -100.0% |
| 2016 | 0.0¢ | 0% |
| 2017 | 0.0¢ | 0% |
| 2018 | 0.0¢ | 0% |
| 2019 | 10.0¢ | 100% |
| 2020 | 10.0¢ | 0% |
LPKF Laser & Electronics AG Optimized Dividend Chart
- Dividend Yield Today
- 0.0%
- Optimized Yield
- Sign Up Required
- 52 Week High
- 0.0% on 24 November 2023
- 52 Week Low
- 0.0% on 24 November 2023
- Next Ex-Div-Date Countdown
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About LPKF Laser & Electronics AG
LPKF Laser & Electronics AG is a German-based developer of laser systems and process solutions for printed circuit board (PCB) technology and microelectronics. Its products are aimed at customers in the automotive, electronics, telecommunications and solar sectors. The Group is active in the following segments: Rapid Prototyping offers solutions for the in-house prototyping and assembly of various PCBs without the use of chemicals; Cutting and Structuring Lasers division supplies laser systems and process expertise for the production of interconnect devices; Joining Technologies segment sells laser systems for welding plastic components; Thin-film Technologies segment is involved with the development and production of laser systems for scribing thin-film solar panels and other segments include production services. In December 2013, the Company acquired shares in its Slovenia-based subsidiary, LPKF Laser & Elektronika doo, thus holding 100% of the shares in all of its subsidiaries.
- Sector
- Electronic & Electrical Equipment
- Country
- Germany
- Share Price
- €8.60 (yesterday's closing price)
- Shares in Issue
- 24 million
- Market Cap
- €211mn
- 2.0
- 0
- Market Indices
- none
